EMI shielding device

ABSTRACT

An EMI shielding device ( 1 ) is set in an electronic device. The electronic device includes a shell, a circuit board set in the shell, and an electrical component set on the circuit board. The shielding device includes a middle board and a shielding cover. The middle board is set inside the electronic device. The shielding cover is set on the middle board and covers an outside of the electrical component. Thus, the EMI shielding device is structured. The material of the shielding cover is widely used, so the cost of the material is markedly reduced. After the shielding cover is opened, it is easy to restore the shielding state. The shielding cover is set inside the electronic device via the middle board, so assembly is easy and it is not limited by changes in the shape or the structure of the shell, so applicability is improved.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an EMI shielding device (1), and morespecifically to an EMI shielding device that shield s electricalcomponents, such as a chip or a CPU, from EMI.

2. Description of the Prior Art

A shielding cover is used to shield electrical components from EMI(Electromagnetic Interference) and prevents electrical components set onthe circuit board of an electronic device (such as a mobile phone, aPDA, or a computer) from the effects of EMI. The electrical componentmay be a chip or a CPU, etc. The shielding cover covers the outside ofthe electrical component set on a circuit board to shield the electricalcomponents from EMI.

However, the shielding cover must be welded onto the circuit board by anSMT (surface mount technology) process, thus, the material of theshielding cover must be a certain welding material. However, the cost ofsuch material is high. Moreover, when the electronic device needs to berepaired, the top board of the shielding cover must be lifted away, andanother top board is needed after the repair to place the EMI shield,further increasing costs.

Hence, the inventors of the present invention believe that theseshortcomings above are able to be improved upon and suggest the presentinvention which is of a reasonable design and is an effectiveimprovement based on deep research and thought.

SUMMARY OF THE INVENTION

An object of the present invention is to provide an EMI shielding device(1), of which the material of the shielding cover is widely used, sothat the cost of the material is reduced. Thereby, after the shieldingcover has been opened, it is easy to restore the shielding state, andanother cover doesn't need to replace the original shield.

Another object of the present invention is to provide an EMI shieldingdevice (1), in which the assembling of the shielding cover is easy, thesurface of which is flat, and which is not limited by changes in theshape or the structure of the shell, so applicability is improved.

To achieve the above-mentioned objects, an EMI shielding device (1) isdisclosed. The shielding device is set in an electronic device andcomprises a shell, a circuit board set in the shell, and an electricalcomponent set on the circuit board. The shielding device comprises amiddle board and a shielding cover. The middle board is set inside theelectronic device and the shielding cover is set on the middle board andcovers the outside of the electrical component.

The advantages of the present invention are that the shielding cover ofthe present invention doesn't need to be welded on the circuit board;the material of the shielding cover is widely used, so the material'scost is reduced; to repair the electrical component, the middle boardand the circuit board can be separated to open the shielding cover;after repairing, the middle board can be fixed inside the electronicdevice to cover the shielding cover over the electrical component torestore the shield. Moreover, the shielding cover is set inside theelectronic device by the middle board, so assembly is easy, the surfaceis flat, and the shield is not limited by changes in the shape or thestructure of the shell, so applicability is improved.

To further understand the features and technical contents of the presentinvention, please refer to the following detailed description anddrawings related to the present invention. However, the drawings areonly to be used as references and explanations, and not to limit thepresent invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of a first embodiment of the present invention;

FIG. 2 is an explored isometric view of the first embodiment of thepresent invention;

FIG. 3 is a cutaway view of the first embodiment of the presentinvention;

FIG. 4 is an explored isometric view of a second embodiment of thepresent invention;

FIG. 5 is a cutaway view of the second embodiment of the presentinvention;

FIG. 6 is an explored isometric view of a third embodiment of thepresent invention;

FIG. 7 is a cutaway view of the third embodiment of the presentinvention;

FIG. 8 is an explored isometric view of a forth embodiment of thepresent invention;

FIG. 9 is a cutaway view of the forth embodiment of the presentinvention;

FIG. 10 is an isometric view of a fifth embodiment of the presentinvention;

FIG. 11 is a cutaway view of a sixth embodiment of the presentinvention;

FIG. 12 is an isometric view of a shielding cover of a seventhembodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Referring to FIGS. 1-3, an EMI shielding device (1) of the presentinvention is set in an electronic device, the device's number beingunlimited. The electronic device includes a shell 4 and a circuit board5 set in the shell 4 and an electrical component 6 set on the circuitboard 5. The shell 4 includes an upper shell 41 and a lower shell 42.The upper shell 41 and the lower shell 42 are assembled or opened bycatches or locking screws. The shielding device includes a middle board1, a shielding cover 2, and a spring component 3. The middle board 1 ismade of metal, rubber or other materials. The middle board 1 is alsoknown as an inner board. The shape of the middle board is unlimited. Aplurality of fixing holes 11 are set on the edge of the middle board 1to fix the locking screws inside the electronic device. The middle board1 is locked onto the circuit board 5 or the shell 4.

The middle board 1 of the embodiment is fixed on the circuit board 5 orthe shell 4 via locking screws, but the fixing method is unlimited. Themiddle board 1 of the embodiment is fixed on the circuit board 5 or theshell 4 inside the electronic device by methods such as hot melting,riveting, spot welding, clamp-jointing or screw-jointing, etc. Aplurality of connectors 12 are set on the middle board 1, and theplurality of connectors 12 are in-molded on the middle board 1 orassembled thereon. In the present embodiment, the connectors 12 are madeof hot-melting material.

The shielding cover 2 is made of metal and is cube-shaped and emptyinside, however the shielding cover 2 can be any other shape. Theshielding cover 2 includes a top board 21 and side boards 22 extendingdownwards around the edge of the top board 21. The top board 21 and theside boards 22 form a containing space 23. The containing space 23 isinside the shielding cover 2 and can contain an electrical component 6.The shielding cover 2 covers the electrical component 6.

Protruding flanges 24 extend outwards from four angles of the top board21. Each protruding flange 24 defines a connecting hole 25 thereon. Eachconnector 12 can be inserted into the corresponding connecting hole 25.The connectors 12 and the connecting holes 25 are fixed and joined byhot-melting to make the shielding cover 2 join the middle board 1corresponding to the electrical component 6. The jointing method of theshielding cover 2 and the middle board 1 is hot-melting, but the middleboard can also be riveted, spot welded, clamp-jointed or screw-jointed,etc. The jointing methods are unlimited.

A plurality of protruding points 34 are defined on the top board 21 ofthe shielding cover 2 by punching thereon to form a spring component 3.The protruding points 34 protrude out of the top board 21 and sustainthe bottom of the middle board 1 to press down the shielding cover 2befittingly. Thus, the bottom edge of the shielding cover 2 can sustainthe topside of the circuit board 5 elastically to join the shieldingcover 2 and the circuit board 5 firmly.

When the shell 4 is assembled and the middle board 1 is fixed inside theelectronic device, the shielding cover 2 set on the middle board 1covers an outside of the electrical component 6. Thus, the EMI effect onthe operation of the electrical component 6 can be prevented by theshielding of the shielding cover 2. The EMI shielding device (1) of thepresent invention is formed by the structure.

To repair the electrical component 6, the shell 4 of the electronicdevice is opened to separate the middle board 1 and the circuit board 5.The shielding cover 2 comes apart with the electrical component 6. Thus,the electrical component 6 is easy to open and repairing is convenient.After repairing, the middle board 1 is fixed inside the electronicdevice to make the shielding cover 2 cover the electrical component 6thereby restoring the shielding state.

Referring to FIGS. 4 and 5, the spring component 3 of the embodimentcontacts the bottom edge of the side boards 22 of the shielding cover 2.The spring component 3 and the bottom edge of the side boards 22 of theshielding cover 2 are in-molded or assembled. For the preferredembodiment, the spring component 3 is a rubber component 31. When themiddle board 1 is fixed inside the electronic device, the shieldingcover 2 covers the electrical component 6. The rubber component 31 isthen injected with glue to join the bottom edge of the side boards 22 ofthe shielding cover 2. The rubber component 31 is set between the bottomedge of the side boards 22 of the shielding cover 2 and the circuitboard 5 to join the shielding cover 2 and the circuit board 5 togetherfirmly. Thus, the EMI effect on the operation of the electricalcomponent 6 can be prevented by the shielding of the shielding cover 2.

To repair the electrical component 6, the shell 4 of the electronicdevice is opened to separate the middle board 1, the shielding cover 2,the circuit board 5 and the spring component 3. The shielding cover 2 isseparated from the electrical component 6. Thus, the electricalcomponent 6 is easy to open and repairing is convenient. Afterrepairing, the middle board 1 is fixed inside the electronic device tomake the shielding cover 2 cover the electrical component 6 to restorethe shielding state.

Please refer to FIGS. 6-9. The connecting holes 25 of the preferredembodiment are defined on the top of the shielding cover 2, that is, theconnecting holes 25 are defined on the top board 21 of the shieldingcover 2. The connectors 12 and the connecting holes 25 are fixed andjoined by hot-melting to make the shielding cover 2 join the middleboard 1 corresponding to the electrical component 6. The springcomponent 3 of the embodiment is a plurality of spring plates 32 and 33in-molded on the bottom edge of the side boards 22 of the shieldingcover 2. The spring plate 32 extends and bends outwards (as shown inFIGS. 6 and 7), the spring plate 33 extends and bends inwards (shown asFIGS. 8, 9). When the middle board 1 is fixed inside the electronicdevice, the shielding cover 2 covers the electrical component 6. Thespring plates 32, 33 sustain elastically the top of the circuit board 5,and the spring plates 32, 33 are set between the bottom edge of the sideboards 22 of the shielding cover 2 and the circuit board 5 to join theshielding cover 2 and the circuit board 5 firmly.

Referring to FIG. 10, the middle board 1 and the shielding cover 2 arein-molded, that is, the top board 21 of the shielding cover 2 isin-molded onto the middle board 1. Four side boards 22 extend downwardsaround the edge of top board 21 by punching on the middle board 1. Thetop board 21 and the side boards 22 form a containing space 23. Themiddle board 1 and the shielding cover 2 are in-molded, and a pluralityof shielding covers 2 can be set upon the middle board 1. Such a designreduces material usage, makes assembly convenient, and lowers costs.

Referring to FIGS. 11 and 12, the spring component 3 of the embodimentis a plurality of spring bodies 35. The spring bodies 35 contact thebottom edge of the side boards 22 of the shielding cover 2. The bottomedge of the side boards 22 of the shielding cover 2 extends and bendsoutwards. The spring bodies 35 are set at the extending and bendingpoint of the side boards 22. The spring bodies 35 sustain the top of thecircuit board 5 elastically.

Consequently, the shielding cover 2 of the present invention doesn'tneed to be welded on the circuit board 5 by a process of SMT. Thematerial of the shielding cover 2 is widely used, so the cost of thematerial is markedly reduced. Moreover, to repair the electricalcomponent 6, the shell 4 is opened to separate the middle board 1, theshielding cover 2 and the circuit board 5 to make the shielding cover 2open. After repairing, the middle board 1 is fixed inside the electronicdevice to make the shielding cover 2 cover the electrical component 6 torestore shielding. Shielding is restored easily and another cover isn'trequired.

Also worth mentioning is that the shielding cover 2 of the presentinvention is set inside the electronic device by the middle board 1. Themiddle board 1 can also be locked on the circuit board 5 or the shell 4.Assembling is therefore easy, surface flatness of the middle board 1 ismaintained and the shielding cover 2 is locked on the shell 4indirectly, so as not to be limited by changes in the shape or thestructure of the shell 4, thereby improving applicability.

What is disclosed above are only the preferred embodiments of thepresent invention, and therefore it is intended that the presentinvention not be limited to the particular embodiment disclosed. Itshould be understood by those skilled in the art that various equivalentchanges may be made depending on the specification and the drawings ofpresent invention without departing from the scope of the presentinvention.

1. An EMI shielding device, set in an electronic device, the electronicdevice comprises a shell, a circuit board set in the shell, and anelectrical component set on the circuit board, the shielding devicecomprising: a middle board set inside the electronic device; wherein themiddle board defines a plurality of fixing holes thereon and is lockedin the electronic device by screwing locks; a shielding cover set on themiddle board and covering an outside of the electrical component; and aspring component set on the top of the shielding cover comprising aplurality of protruding points, wherein the protruding pointselastically contact the bottom of the middle board for biasing a bottomedge of said shielding cover into contact with a top of said circuitboard.
 2. The EMI shielding device as claimed in claim 1, wherein themiddle board is fixed in the electronic device by hot melting, riveting,spot welding, clamp-jointing, or screw-jointing.
 3. The EMI shieldingdevice as claimed in claim 1, wherein the middle board is fixed on thecircuit board.
 4. The EMI shielding device as claimed in claim 1,wherein the middle board is fixed on the shell.
 5. The EMI shieldingdevice as claimed in claim 1, wherein a plurality of connectors is seton the middle board, a plurality of connecting holes is set on theshielding cover, the connectors and the connecting holes are joined. 6.The EMI shielding device as claimed in claim 1, wherein the shieldingcover is made of metal.
 7. The EMI shielding device as claimed in claim1, wherein the shielding cover comprises a top board and side boardsextending downwards around the edge of top board, the top board and theside boards form a containing space, the electrical component is set inthe containing space.
 8. The EMI shielding device as claimed in claim 1,wherein the shielding cover is fixed on the middle board by hot melting,riveting, spot welding, clamp-jointing, or screw-jointing.
 9. The EMIshielding device as claimed in claim 1, wherein the shielding cover isin-molded on the middle board.
 10. The EMI shielding device as claimedin claim 1, wherein the spring component is in-molded on the shieldingcover.
 11. The EMI shielding device as claimed in claim 1, wherein thespring component is assembled with the shielding cover.
 12. The EMIshielding device (1) as claimed in claim 1, wherein the spring componentis set on the bottom edge of the shielding cover and sustains the top ofthe circuit board.
 13. The EMI shielding device (1) as claimed in claim12, wherein the spring component is a rubber component, which isconnected between the bottom edge of the shielding cover and the circuitboard.
 14. The EMI shielding device (1) as claimed in claim 12, whereinthe spring component is a plurality of spring plates connecting with thebottom edge of the shielding cover, the spring plates sustainelastically the top the circuit board.
 15. The EMI shielding device (1)as claimed in claim 12, wherein the spring component is a plurality ofspring bodies connecting with the bottom edge of the shielding cover,the spring bodies sustain elastically the top the circuit board.